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- ASM SIPLACE automatic placement machines
- Automatic potting machines for ml-accurate dosing of the potting compound
- ESD-compliant production area, air-conditioned and air humidity controlled
- SAP-controlled production planning and material flow
- Complete transparency for every component and every production order
- 100% final test
- Highly variable production spectrum, from the printed circuit board to the fully assembled product
component placement systems, casting robots that dose the compound with millimetre precision
optical inspection after paste printing
Component feeder
Revolver Head
Pick-and-Place
Optical control before soldering
Result of the soldering process
Optical control after soldering
Preparation of optional selective soldering
Selective soldering machine
Selective soldering process
Manual soldering
Individual bonding of special components
Final assembly of the manufactured printed circuit boards (PCB)
Automatic potting machines for ml-accurate dosing of the potting compound
Result of the potting process
Final manual assembly
Final product
100% endtest of the final product
Development & OEM electronic series production “Made in Germany”